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production pending this data sheet states amd?s current technical specifications regarding the products described herein. this data sheet may be revised by subsequent versions or modifications due to changes in technical specifications. publication# 26009 rev: c amendment/ 0 issue date: april 7, 2003 production subject to customer demand. contact your local amd sales representative for more information AM29LV017M 16 megabit (2 m x 8-bit) mirrorbit tm 3.0 volt-only uniform sector flash memory distinctive characteristics single power supply operation ? 2.7 to 3.6 volt read and write operations for battery-powered applications manufactured on 0.23 m mirrorbit process technology ? compatible with and replaces am29lv017b device secsi tm (secured silicon) sector region ? 128-word/256-byte sector for permanent, secure identification through an 8-word/16-byte random electronic serial number, accessible through a command sequence ? may be programmed and locked at the factory or by the customer high performance ? access times as fast as 70 ns ultra low power consumption (typical values at 5 mhz) ? 400 na automatic sleep mode current ? 400 na standby mode current ? 15 ma read current ? 40 ma program/erase current flexible sector architecture ? thirty-two 64 kbyte sectors ? supports full chip erase ? sector protection features: a hardware method of locking a sector to prevent any program or erase operations within that sector sectors can be locked in-system or via programming equipment temporary sector unprotect feature allows code changes in previously locked sectors unlock bypass program command ? reduces overall programming time when issuing multiple program command sequences embedded algorithms ? embedded erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors ? embedded program algorithm automatically writes and verifies data at specified addresses minimum 100,000 erase cycle guarantee per sector 20-year data retention at 125 c ? reliable operation for the life of the system package option ? 48-ball fbga ? 40-pin tsop cfi (common flash interface) compliant ? provides device-specific information to the system, allowing host software to easily reconfigure for different flash devices compatibility with jedec standards ? pinout and software compatible with single- power supply flash ? superior inadvertent write protection data# polling and toggle bits ? provides a software method of detecting program or erase operation completion ready/busy# pin (ry/by#) ? provides a hardware method of detecting program or erase cycle completion erase suspend/erase resume ? suspends an erase operation to read data from, or program data to, a sector that is not being erased, then resumes the erase operation hardware reset pin (reset#) ? hardware method to reset the device to reading array data command sequence optimized for mass storage ? specific address not required for unlock cycles
2 AM29LV017M april 7, 2003 pending general description the AM29LV017M is a 16 mbit, 3.0 volt-only flash memory organized as 2,097,152 bytes. the device is offered in 48-ball fbga and 40-pin tsop packages. the byte-wide (x8) data appears on dq7?dq0. all read, program, and erase operations are accomplished using only a single power s upply. the device can also be programmed in standard eprom programmers. the standard device offers access times of 70, 90, and 120 ns, allowing high speed microprocessors to operate without wait states. to eliminate bus conten- tion the device has separate chip enable (ce#), write enable (we#) and output enable (oe#) controls. the device requires only a single 3.0 volt power sup- ply for both read and write functions. internally gener- ated and regulated voltages are provided for the program and erase operations. the device is entirely command set compatible with the jedec single-power-supply flash standard . com- mands are written to the command register using stan- dard microprocessor write timings. register contents serve as input to an internal state-machine that con- trols the erase and programming circuitry. write cycles also internally latch addresses and data needed for the programming and erase operations. reading data out of the device is similar to reading from other flash or eprom devices. device programming occurs by executing the program command sequence. this initiates the embedded program algorithm?an internal algorithm that auto- matically times the program pulse widths and verifies proper cell margin. the unlock bypass mode facili- tates faster programming times by requiring only two write cycles to program data instead of four. device erasure occurs by executing the erase com- mand sequence. this initiates the embedded erase algorithm?an internal algorit hm that automatically pre- programs the array (if it is not already programmed) be- fore executing the erase operation. during erase, the device automatically times the erase pulse widths and verifies proper cell margin. the host system can detect whether a program or erase operation is complete by observing the ry/by# pin, or by reading the dq7 (data# polling) and dq6 (toggle) status bits . after a program or erase cycle has been completed, the device is ready to read array data or accept another command. the sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. the device is fully erased when shipped from the factory. hardware data protection measures include a low v cc detector that automatically inhibits write opera- tions during power transitions. the hardware sector protection feature disables both program and erase operations in any combination of the sectors of mem- ory. this can be achieved in-system or via program- ming equipment. the erase suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. the program suspend/program resume feature enables the host system to pause a program operation in a given sector to read any other sector and then complete the program operation. the hardware reset# pin terminates any operation in progress and resets the internal state machine to reading array data. the reset# pin may be tied to the system reset circuitry. a system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the flash memory. the device offers two power-saving features. when addresses have been stable for a specified amount of time, the device enters the automatic sleep mode . the system can also place the device into the standby mode . power consumption is greatly reduced in both these modes. amd?s mirrorbit flash technology combines years of flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effec- tiveness. the device electr ically erases all bits within a sector simultaneously via fowler-nordheim tunneling. the data is programmed using hot electron injection.
april 7, 2003 AM29LV017M 3 pending table of contents product selector guide . . . . . . . . . . . . . . . . . . . . . 4 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 connection diagrams . . . . . . . . . . . . . . . . . . . . . . . 5 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 7 logic symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 ordering information . . . . . . . . . . . . . . . . . . . . . . . 8 device bus operations . . . . . . . . . . . . . . . . . . . . . . 9 table 1. AM29LV017M device bus operations................................ 9 requirements for reading array data ..................................... 9 writing commands/command sequences .............................. 9 program and erase operation status .................................... 10 standby mode ........................................................................ 10 automatic sleep mode ........................................................... 10 reset#: hardware reset pin ............................................... 10 output disable mode .............................................................. 10 table 2. AM29LV017M sector address table................................ 11 autoselect mode ..................................................................... 12 table 3. AM29LV017M autoselect codes (high voltage method) . 12 sector protection/unprotection ............................................... 13 temporary sector unprotect .................................................. 13 figure 1. temporary sector unprotect operation........................... 13 secsi (secured silicon) sector flash memory region .......... 15 table 1. secsi sector contents ......................................................15 figure 3. secsi sector protect verify.............................................. 16 hardware data protection ...................................................... 16 low v cc write inhibit .............................................................. 16 write pulse ?glitch? protection ............................................... 16 logical inhibit .......................................................................... 16 power-up write inhibit ............................................................ 16 common flash memory interface (cfi) . . . . . . . 17 table 4. cfi query identification string.......................................... 17 table 5. system interface string..................................................... 17 table 6. device geometry definition .............................................. 18 table 7. primary vendor-specific extended query ........................ 19 command definitions . . . . . . . . . . . . . . . . . . . . . . 20 reading array data ................................................................ 20 reset command ..................................................................... 20 autoselect command sequence ............................................ 20 byte program command sequence ....................................... 20 unlock bypass command sequence ..................................... 21 figure 4. program operation .......................................................... 21 program suspend/program resume command sequence ... 22 figure 5. program suspend/program resume............................... 22 chip erase command sequence ........................................... 23 sector erase command sequence ........................................ 23 erase suspend/erase resume commands ........................... 23 figure 6. erase operation............................................................... 24 command definitions ............................................................. 25 table 8. AM29LV017M command definitions .............................. 25 write operation status . . . . . . . . . . . . . . . . . . . . 26 dq7: data# polling ................................................................. 26 figure 7. data# polling algorithm .................................................. 26 ry/by#: ready/busy# ............................................................ 27 dq6: toggle bit i .................................................................... 27 dq2: toggle bit ii ................................................................... 27 reading toggle bits dq6/dq2 ............................................... 27 figure 8. toggle bit algorithm........................................................ 28 dq5: exceeded timing limits ................................................ 29 dq3: sector erase timer ....................................................... 29 table 9. write operation status..................................................... 29 absolute maximum ratings . . . . . . . . . . . . . . . . 30 figure 9. maximum negative overshoot waveform ...................... 30 figure 10. maximum positive overshoot waveform...................... 30 operating ranges . . . . . . . . . . . . . . . . . . . . . . . . 30 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . 31 test conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 32 figure 11. test setup..................................................................... 32 table 10. test specifications ......................................................... 32 figure 12. input waveforms and measurement levels ................. 32 ac characteristics . . . . . . . . . . . . . . . . . . . . . . . . 33 read operations .................................................................... 33 figure 13. read operations timings ............................................. 33 hardware reset (reset#) .................................................... 34 figure 14. reset# timings .......................................................... 34 erase/program operations ..................................................... 35 figure 15. program operation timings.......................................... 36 figure 16. chip/sector erase operation timings .......................... 36 figure 17. data# polling timings (during embedded algorithms). 37 figure 18. toggle bit timings (during embedded algorithms)...... 38 figure 19. dq2 vs. dq6................................................................. 38 figure 20. temporary sector unprotect timing diagram .............. 39 figure 21. sector protect/unprotect timing diagram .................... 40 figure 22. alternate ce# controlled write operation timings ...... 42 latchup characteristics . . . . . . . . . . . . . . . . . . . 43 tsop pin capacitance . . . . . . . . . . . . . . . . . . . . 43 data retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 physical dimensions . . . . . . . . . . . . . . . . . . . . . . 44 ts 040?40-pin standard tsop ............................................ 44 tsr040?40-pin reverse tsop ........................................... 45 fba048?48-ball fine-pitch ball grid array (fbga) 8 x 6 mm package .................................................................. 46 revision summary . . . . . . . . . . . . . . . . . . . . . . . . 47 revision a (june 24, 2002) .................................................... 47 revision a + 1 (july 3, 2002) .................................................. 47 revision b (december 9, 2002) .............................................. 47
4 AM29LV017M april 7, 2003 pending product selector guide note: see ?ac characteristics? for full specifications. block diagram family part number AM29LV017M speed option v cc = 2.7?3.6 v 70 90 120 v cc = 3.0?3.6 v 70r 90r 120r max access time, ns (t acc )7090120 max ce# access time, ns (t ce )7090120 max oe# access time, ns (t oe )303550 input/output buffers x-decoder y-decoder chip enable output enable logic erase voltage generator pgm voltage generator timer v cc detector state control command register v cc v ss we# ce# oe# stb stb dq0 ? dq7 sector switches ry/by# reset# data latch y-gating cell matrix address latch a0?a20
april 7, 2003 AM29LV017M 5 pending connection diagrams 1 16 2 3 4 5 6 7 8 17 18 19 20 9 10 11 12 13 14 15 40 25 39 38 37 36 35 34 33 32 31 30 29 28 27 26 24 23 22 21 a16 a5 a15 a14 a13 a12 a11 a9 a8 we# reset# nc ry/by# a18 a7 a6 a4 a3 a2 a1 a17 dq0 v ss a20 a19 a10 dq7 dq6 dq5 oe# v ss ce# a0 dq4 v cc v cc nc dq3 dq2 dq1 1 16 2 3 4 5 6 7 8 17 18 19 20 9 10 11 12 13 14 15 40 25 39 38 37 36 35 34 33 32 31 30 29 28 27 26 24 23 22 21 a16 a5 a15 a14 a13 a12 a11 a9 a8 we# reset# nc ry/by# a18 a7 a6 a4 a3 a2 a1 a17 dq0 v ss a20 a19 a10 dq7 dq6 dq5 oe# v ss ce# a0 dq4 v cc v cc nc dq3 dq2 dq1 40-pin reverse tsop 40-pin standard tsop
6 AM29LV017M april 7, 2003 pending connection diagram special handling instructions for fbga packages special handling is required for flash memory products in molded packages (fbga and tsop). the package and/or data integrity may be compromised if the package body is exposed to temperatures above 150c for prolonged periods of time. a1 b1 a2 b2 c1 c2 d1 d2 e1 e2 f1 f2 g1 g2 h1 a3 a4 a2 a1 a0 ce# oe# v ss a7 a18 a6 a5 dq0 nc nc dq1 ry/by# nc nc nc dq2 dq3 v cc nc we# reset# nc nc dq5 nc v cc dq4 a9 a8 a11 a12 a19 a10 dq6 dq7 a14 a13 a15 a16 a17 nc a20 v ss a3 b3 c3 d3 e3 f3 g3 h3 a4 b4 c4 d4 e4 f4 g4 h4 a5 b5 c5 d5 e5 f5 g5 h5 a6 b6 c6 d6 e6 f6 g6 h6 h2 48-ball fbga (top view, balls facing down)
april 7, 2003 AM29LV017M 7 pending pin configuration a0?a20=21 addresses dq0?dq7=8 data inputs/outputs ce# = chip enable oe# = output enable we# = write enable reset#=hardware reset pin, active low ry/by#= ready/busy output v cc = 3.0 volt-only single power supply (see product selector guide for speed options and voltage supply tolerances) v ss = device ground nc = pin not connected internally logic symbol 21 8 dq0?dq7 a0?a20 ce# oe# we# reset# ry/by#
8 AM29LV017M april 7, 2003 pending ordering information standard products amd standard products are available in several package s and operating ranges. the order number (valid combi- nation) is formed by a combi nation of the elements below. production pending production subject to customer demand. contact your local amd sales representative to request ordering information. valid combinations valid combinations list configurations planned to be sup- ported in volume for this device. consult the local amd sales office to confirm availability of specific valid combinations and to check on newly released combinations. AM29LV017M 70 e i temperature range i = industrial (?40 c to +85 c) package type e = 40-pin thin small outline package (tsop) standard pinout (ts 040) f = 40-pin thin small outline package (tsop) reverse pinout (tsr040) wa = 48-ball fine-pitch ball grid array (fbga) 0.80 mm pitch, 8 x 6 mm package (fba048) speed option see product selector guide and valid combinations device number/description AM29LV017M 16 megabit (2 m x 8-bit) cmos flash memory 3.0 volt-only read, program and erase
april 7, 2003 AM29LV017M 9 pending device bus operations this section describes the requirements and use of the device bus operations, which are initiated through the internal command register. the command register itself does not occupy any addressable memory location. the register is composed of latches that store the com- mands, along with the address and data information needed to execute the command. the contents of the register serve as inputs to the internal state machine. the state machine outputs dictate the function of the device. table 1 lists the device bus operations, the in- puts and control levels they require, and the resulting output. the following subsections describe each of these operations in further detail. table 1. AM29LV017M device bus operations legend: l = logic low = v il , h = logic high = v ih , v id = 12.0 0.5 v, x = don?t care, a in = address in, d in = data in, d out = data out note: the sector protect and sector unprotect functions may also be implemented via programming equipment. see the ?sector protection/unprotection? section. requirements for reading array data to read array data from the outputs, the system must drive the ce# and oe# pins to v il . ce# is the power control and selects the device. oe# is the output con- trol and gates array data to the output pins. we# should remain at v ih . the internal state machine is set for reading array data upon device power-up, or after a hardware reset. this ensures that no spurious alteration of the memory con- tent occurs during the power transition. no command is necessary in this mode to obtain array data. standard microprocessor read cycles that assert valid addresses on the device address inputs produce valid data on the device data outputs. the device remains enabled for read access until the command register contents are altered. see ?reading array data? for more information. refer to the ac read operations table for timing specifica- tions and to figure 13 for the timing diagram. i cc1 in the dc characteristics table represents the active cur- rent specification for reading array data. writing commands/command sequences to write a command or command sequence (which in- cludes programming data to the device and erasing sectors of memory), the system must drive we# and ce# to v il , and oe# to v ih . the device features an unlock bypass mode to facil- itate faster programming. once the device enters the unlock bypass mode, only two write cycles are re- quired to program a byte, instead of four. the ?byte program command sequence? section has details on programming data to the device using both standard and unlock bypass command sequences. an erase operation can erase one sector, multiple sec- tors, or the entire device. table 2 indicates the address space that each sector occupies. a ?sector address? consists of the address bits required to uniquely select a sector. the ?word/byte program command se- quence? section has details on erasing a sector or the entire chip, or suspending/resuming the erase opera- tion. after the system writes the autoselect command se- quence, the device enters the autoselect mode. the system can then read autoselect codes from the inter- operation ce# oe# we# reset# addresses dq0?dq7 read l l h h a in d out write l h l h a in d in standby v cc 0.3 v xx v cc 0.3 v xhigh-z output disable l h h h x high-z reset x x x l x high-z sector protect (see note) l h l v id sector addresses, a6 = l, a1 = h, a0 = l d in , d out sector unprotect (see note) l h l v id sector addresses a6 = h, a1 = h, a0 = l d in , d out temporary sector unprotect x x x v id a in d in
10 AM29LV017M april 7, 2003 pending nal register (which is separate from the memory array) on dq7?dq0. standard read cycle timings apply in this mode. refer to the autoselect mode and autoselect command sequence sections for more information. i cc2 in the dc characteristics table represents the ac- tive current specification for the write mode. the ?ac characteristics? section contains timing specification tables and timing diagrams for write operations. program and erase operation status during an erase or program operation, the system may check the status of the operation by reading the status bits on dq7?dq0. standard read cycle timings and i cc read specifications apply. refer to ?write operation status? for more information, and to ?ac characteris- tics? for timing diagrams. standby mode when the system is not reading or writing to the device, it can place the device in the standby mode. in this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, inde- pendent of the oe# input. the device enters the cmos standby mode when the ce# and reset# pins are both held at v cc 0.3 v. (note that this is a more restricted voltage range than v ih .) if ce# and reset# are held at v ih , but not within v cc 0.3 v, the device will be in the standby mode, but the standby current will be greater. the device requires standard access time (t ce ) for read access when the device is in either of t hese standby modes, before it is ready to read data. the device also enters the standby mode when the reset# pin is driven low. refer to the next section, ?reset#: hardware reset pin?. if the device is deselected during erasure or program- ming, the device draws active current until the operation is completed. i cc3 in the dc characteristics table represents the standby current specification. automatic sleep mode the automatic sleep mode minimizes flash device energy consumption. the device automatically enables this mode when addresses remain stable for t acc + 30 ns. the automatic sleep mode is independent of the ce#, we#, and oe# control signals. standard address access timings provide new data when addresses are changed. while in sleep mode, output data is latched and always available to the system. i cc4 in the dc characteristics table represents the automatic sleep mode current specification. reset#: hardware reset pin the reset# pin provides a hardware method of reset- ting the device to reading array data. when the re- set# pin is driven low for at least a period of t rp , the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the reset# pulse. the device also resets the internal state ma- chine to reading array data. the operation that was in- terrupted should be reinitia ted once the device is ready to accept another command sequence, to ensure data integrity. current is reduced for the duration of the reset# pulse. when reset# is held at v ss 0.3 v, the device draws cmos standby current (i cc4 ). if reset# is held at v il but not within v ss 0.3 v, the standby current will be greater. the reset# pin may be tied to the system reset cir- cuitry. a system reset would thus also reset the flash memory, enabling the system to read the boot-up firm- ware from the flash memory. if reset# is asserted during a program or erase oper- ation, the ry/by# pin remains a ?0? (busy) until the in- ternal reset operation is complete, which requires a time of t ready (during embedded algorithms). the system can thus monitor ry/by# to determine whether the reset operation is complete. if reset# is asserted when a program or erase oper ation is not executing (ry/by# pin is ?1?), the reset operation is completed within a time of t ready (not during embedded algo- rithms). the system can read data t rh after the re- set# pin returns to v ih . refer to the ac characteristics tables for reset# pa- rameters and to figure 14 for the timing diagram. output disable mode when the oe# input is at v ih , output from the device is disabled. the output pins are placed in the high imped- ance state.
april 7, 2003 AM29LV017M 11 pending table 2. AM29LV017M sector address table sector a20 a19 a18 a17 a16 address range (in hexadecimal) sa0 0 0 0 0 0 000000?00ffff sa1 0 0 0 0 1 010000?01ffff sa2 0 0 0 1 0 020000?02ffff sa3 0 0 0 1 1 030000?03ffff sa4 0 0 1 0 0 040000?04ffff sa5 0 0 1 0 1 050000?05ffff sa6 0 0 1 1 0 060000?06ffff sa7 0 0 1 1 1 070000?07ffff sa8 0 1 0 0 0 080000?08ffff sa9 0 1 0 0 1 090000?09ffff sa10 0 1 0 1 0 0a0000?0affff sa11 0 1 0 1 1 0b0000?0bffff sa12 0 1 1 0 0 0c0000?0cffff sa13 0 1 1 0 1 0d0000?0dffff sa14 0 1 1 1 0 0e0000?0effff sa15 0 1 1 1 1 0f0000?0fffff sa16 1 0 0 0 0 100000?10ffff sa17 1 0 0 0 1 110000?11ffff sa18 1 0 0 1 0 120000?12ffff sa19 1 0 0 1 1 130000?13ffff sa20 1 0 1 0 0 140000?14ffff sa21 1 0 1 0 1 150000?15ffff sa22 1 0 1 1 0 160000?16ffff sa23 1 0 1 1 1 170000?17ffff sa24 1 1 0 0 0 180000?18ffff sa25 1 1 0 0 1 190000?19ffff sa26 1 1 0 1 0 1a0000?1affff sa27 1 1 0 1 1 1b0000?1bffff sa28 1 1 1 0 0 1c0000?1cffff sa29 1 1 1 0 1 1d0000?1dffff sa30 1 1 1 1 0 1e0000?1effff sa31 1 1 1 1 1 1f0000?1fffff
12 AM29LV017M april 7, 2003 pending autoselect mode the autoselect mode provides manufacturer and de- vice identification, and sector protection verification, through identifier codes output on dq7?dq0. this mode is primarily intended for programming equipment to automatically match a device to be programmed with its corresponding programming algorithm. however, the autoselect codes can also be accessed in-system through the command register. when using programming equipment, the autoselect mode requires v id (11.5 v to 12.5 v) on address pin a9. address pins a6, a1, and a0 must be as shown in table 3. in addition, when verifying sector protection, the sector address must appear on the appropriate highest order address bits (see table 2). table 3 shows the remaining address bits that are don?t care. when all necessary bits have been set as required, the program- ming equipment may then read the corresponding identifier code on dq7-dq0. to access the autoselect codes in-system, the host system can issue the autoselect command via the command register, as shown in table 8. this method does not require v id . see ?? for details on using the au- toselect mode. table 3. AM29LV017M autoselect codes (high voltage method) l = logic low = v il , h = logic high = v ih , sa = sector address, x = don?t care. description ce# oe# we# a20 to a16 a15 to a10 a9 a8 to a7 a6 a5 to a2 a1 a0 dq7 to dq0 manufacturer id : amd l l h x x v id xlxll 01h device id: AM29LV017M l l h x x v id xlxlh c8h sector protection verification l l h sa x v id xlxhl 01h (protected) 00h (unprotected)
april 7, 2003 AM29LV017M 13 pending sector protection/unprotection the hardware sector protection feature disables both program and erase operations in any sector. the hard- ware sector unprotection feature re-enables both pro- gram and erase operations in previously protected sectors. sector protection/unprotection requires v id on the re- set# pin only, and can be implemented either in-sys- tem or via programming equipment. figure 2 shows the algorithms and figure 21 shows the timing diagram. this method uses standard microprocessor bus cycle timing. for sector unprotect, all unprotected sectors must first be protected prior to the first sector unprotect write cycle. the device is shipped with all sectors unprotected. amd offers the option of programming and protecting sectors at its factory prior to shipping the device through amd?s expressflash? service. contact an amd representative for details. it is possible to determine whether a sector is protected or unprotected. see ?autoselect mode? for details. temporary sector unprotect this feature allows temporary unprotection of previ- ously protected sectors to change data in-system. the sector unprotect mode is activated by setting the re- set# pin to v id . during this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. once v id is removed from the re- set# pin, all the previously protected sectors are protected again. figure 1 shows the algorithm, and figure 20 shows the timing diagrams, for this feature. figure 1. temporary sector unprotect operation start perform erase or program operations reset# = v ih temporary sector unprotect completed (note 2) reset# = v id (note 1) notes: 1. all protected sectors unprotected. 2. all previously protected sectors are protected once again.
14 AM29LV017M april 7, 2003 pending figure 2. in-system single high voltag e sector protect/unprotect algorithms sector protect: write 60h to sector address with a6 = 0, a1 = 1, a0 = 0 set up sector address wait 150 s verify sector protect: write 40h to sector address with a6 = 0, a1 = 1, a0 = 0 read from sector address with a6 = 0, a1 = 1, a0 = 0 start plscnt = 1 reset# = v id wait 1 s first write cycle = 60h? data = 01h? remove v id from reset# write reset command sector protect complete yes yes no plscnt = 25? yes device failed increment plscnt temporary sector unprotect mode no sector unprotect: write 60h to sector address with a6 = 1, a1 = 1, a0 = 0 set up first sector address wait 15 ms verify sector unprotect: write 40h to sector address with a6 = 1, a1 = 1, a0 = 0 read from sector address with a6 = 1, a1 = 1, a0 = 0 start plscnt = 1 reset# = v id wait 1 s data = 00h? last sector verified? remove v id from reset# write reset command sector unprotect complete yes no plscnt = 1000? yes device failed increment plscnt temporary sector unprotect mode no all sectors protected? yes protect all sectors: the indicated portion of the sector protect algorithm must be performed for all unprotected sectors prior to issuing the first sector unprotect address set up next sector address no yes no yes no no yes no single high voltage sector protect algorithm single high voltage sector unprotect algorithm first write cycle = 60h? protect another sector? reset plscnt = 1
april 7, 2003 AM29LV017M 15 pending secsi (secured silicon) sector flash memory region the secsi (secured silicon) sector feature provides a flash memory region that enables permanent part identification through an electronic serial number (esn). the secsi sector is 128 words/256 bytes in length, and uses a secsi sector indicator bit (dq7) to indicate whether or not the secsi sector is locked when shipped from the factory. this bit is permanently set at the factory and cannot be changed, which pre- vents cloning of a factory locked part. this ensures the security of the esn once the product is shipped to the field. amd offers the device with the secsi sector either factory locked or customer lockable. the factory- locked version is always protected when shipped from the factory, and has the secsi (secured silicon) sec- tor indicator bit permanently set to a ?1.? the cus- tomer-lockable version is shipped with the secsi sector unprotected, allowing customers to program the sector after receiving the device. the customer- lockable version also has the secsi sector indicator bit permanently set to a ?0.? thus, the secsi sector in- dicator bit prevents customer-lockable devices from being used to replace devices that are factory locked. the secsi sector address space in this device is allo- cated as follows: the system accesses the secsi sector through a command sequence (see ?enter secsi sector/exit secsi sector command sequence?). after the system has written the enter secsi sector command se- quence, it may read the secsi sector by using the ad- dresses normally occupied by the first sector (sa0). this mode of operation continues until the system is- sues the exit secsi sector command sequence, or until power is removed from the device. on power-up, or following a hardware reset, the device reverts to sending commands to sector sa0. note that the acc function and unlock bypass modes are not available when the secsi sector is enabled. factory locked: secsi sector programmed and protected at the factory in devices with an esn, the secsi sector is protected when the device is shipped from the factory. the secsi sector cannot be modified in any way. a factory locked device has an 8-word/16-byte random esn at ad- dresses 000000h?000007h. customers may opt to have their code programmed by amd through the amd expressflash service. the de- vices are then shipped from amd?s factory with the secsi sector permanently locked. contact an amd representative for details on using amd?s express- flash service. customer lockable: secsi sector not programmed or protected at the factory as an alternative to the factory-locked version, the de- vice may be ordered such that the customer may pro- gram and protect the 128-word/256 bytes secsi sector. the system may program the secsi sector using the write-buffer, accelerated and/or unlock bypass meth- ods, in addition to the standard programming com- mand sequence. see command definitions. programming and protecting the secsi sector must be used with caution since, once protected, there is no procedure available for unprotecting the secsi sector area and none of the bits in the secsi sector memory space can be modified in any way. the secsi sector area can be protected using one of the following procedures: write the three-cycle enter secsi sector region command sequence, and then follow the in-system sector protect algorithm as shown in figure 1, except that reset# may be at either v ih or v id . this allows in-system protection of the secsi sector without raising any device pin to a high voltage. note that this method is only applicable to the secsi sector. to verify the protect/unprotect status of the secsi sector, follow the algorithm shown in figure 2. once the secsi sector is programmed, locked and verified, the system must write the exit secsi sector region command sequence to return to reading and writing within the remainder of the array. table 1. secsi sector contents secsi sector address range standard factory locked expressflash factory locked customer lockable x16 x8 000000h? 000007h 000000h? 00000fh esn esn or determined by customer determined by customer 000008h? 00007fh 000010h? 0000ffh unavailable determined by customer
16 AM29LV017M april 7, 2003 pending figure 3. secsi sector protect verify hardware data protection the command sequence requirement of unlock cycles for programming or erasing provides data protection against inadvertent writes (refer to table 8 for com- mand definitions). in addition, the following hardware data protection measures prevent accidental erasure or programming, which might otherwise be caused by spurious system level signals during v cc power-up and power-down transitions, or from system noise. low v cc write inhibit when v cc is less than v lko , the device does not ac- cept any write cycles. this protects data during v cc power-up and power-down. the command register and all internal program/erase circuits are disabled, and the device resets. subsequent writes are ignored until v cc is greater than v lko . the system must provide the proper signals to the control pins to prevent uninten- tional writes when v cc is greater than v lko . write pulse ?glitch? protection noise pulses of less than 5 ns (typical) on oe#, ce# or we# do not initiate a write cycle. logical inhibit write cycles are inhibited by holding any one of oe# = v il , ce# = v ih or we# = v ih . to initiate a write cy- cle, ce# and we# must be a logical zero while oe# is a logical one. power-up write inhibit if we# = ce# = v il and oe# = v ih during power up, the device does not accept commands on the rising edge of we#. the internal state machine is automatically reset to reading array data on power-up. write 60h to any address write 40h to secsi sector address with a6 = 0, a1 = 1, a0 = 0 start reset# = v ih or v id wait 1 s read from secsi sector address with a6 = 0, a1 = 1, a0 = 0 if data = 00h, secsi sector is unprotected. if data = 01h, secsi sector is protected. remove v ih or v id from reset# write reset command secsi sector protect verify complete
april 7, 2003 AM29LV017M 17 pending common flash memory interface (cfi) the common flash interface (cfi) specification out- lines device and host system software interrogation handshake, which allows specific vendor-specified software algorithms to be used for entire families of devices. software support can then be device-indepen- dent, jedec id-independent, and forward- and back- ward-compatible for the specified flash device families. flash vendors can standardize their existing interfaces for long-term compatibility. this device enters the cfi query mode when the system writes the cfi query command, 98h, to address 55h, any time the device is ready to read array data. the system can read cfi information at the addresses given in tables 4?7. to terminate reading cfi data, the system must write the reset command. the system can also write the cfi query command when the device is in the autoselect mode. the device enters the cfi query mode, and the system can read cfi data at the addresses given in tables 4?7. the system must write the reset command to return the device to reading array data. for further information, please refer to the cfi specifi- cation and cfi publication 100, available online at http://www.amd.com/flash/cfi. alternatively, contact an amd representative for copies of these documents. table 4. cfi query identification string addresses data description 10h 11h 12h 51h 52h 59h query unique ascii string ?qry? 13h 14h 02h 00h primary oem command set 15h 16h 40h 00h address for primary extended table 17h 18h 00h 00h alternate oem command set (00h = none exists) 19h 1ah 00h 00h address for alternate oem extended table (00h = none exists) table 5. system interface string addresses data description 1bh 27h v cc min. (write/erase) d7?d4: volt, d3?d0: 100 millivolt 1ch 36h v cc max. (write/erase) d7?d4: volt, d3?d0: 100 millivolt 1dh 00h v pp min. voltage (00h = no v pp pin present) 1eh 00h v pp max. voltage (00h = no v pp pin present) 1fh 07h typical timeout per single byte/word write 2 n s 20h 00h typical timeout for min. size buffer write 2 n s (00h = not supported) 21h 0ah typical timeout per individual block erase 2 n ms 22h 00h typical timeout for full chip erase 2 n ms (00h = not supported) 23h 01h max. timeout for byte/word write 2 n times typical 24h 00h max. timeout for buffer write 2 n times typical 25h 04h max. timeout per individual block erase 2 n times typical 26h 00h max. timeout for full chip erase 2 n times typical (00h = not supported)
18 AM29LV017M april 7, 2003 pending table 6. device geometry definition addresses data description 27h 15h device size = 2 n byte 28h 29h 00h 00h flash device interface description (refer to cfi publication 100) 2ah 2bh 00h 00h max. number of byte in multi-byte write = 2 n (00h = not supported) 2ch 01h number of erase block regions within device 2dh 2eh 2fh 30h 1fh 00h 00h 01h erase block region 1 information (refer to the cfi specification or cfi publication 100) 31h 32h 33h 34h 00h 00h 00h 00h erase block region 2 information 35h 36h 37h 38h 00h 00h 80h 00h erase block region 3 information 39h 3ah 3bh 3ch 00h 00h 00h 00h erase block region 4 information
april 7, 2003 AM29LV017M 19 pending table 7. primary vendor-specific extended query addresses data description 40h 41h 42h 50h 52h 49h query-unique ascii string ?pri? 43h 31h major version number, ascii 44h 33h minor version number, ascii 45h 08h address sensitive unlock (bit 1-0) 0 = required, 1 = not required process technology (bit 7-2) 10b = 0.23 m mirrorbit 46h 02h erase suspend 0 = not supported, 1 = to read only, 2 = to read & write 47h 01h sector protect 0 = not supported, x = number of sectors in per group 48h 01h sector temporary unprotect: 00 = not supported, 01 = supported 49h 04h sector protect/unprotect scheme 01 = 29f040 mode, 02 = 29f016 mode, 03 = 29f400 mode, 04 = 29lv800a mode 4ah 00h simultaneous operation: 00 = not supported, 01 = supported 4bh 00h burst mode type: 00 = not supported, 01 = supported 4ch 00h page mode type: 00 = not supported, 01 = 4 word page, 02 = 8 word page
20 AM29LV017M april 7, 2003 pending command definitions writing specific address and data commands or sequences into the command register initiates device operations. table 8 defines the valid register command sequences. writing incorrect address and data values or writing them in the improper sequence may place the device in an unknown state. a reset command is then required to return the device to reading array data. all addresses are latched on the falling edge of we# or ce#, whichever happens later. all data is latched on the rising edge of we# or ce#, whichever happens first. refer to the appropriate timing diagrams in the ?ac characteristics? section. reading array data the device is automatically set to reading array data after device power-up. no commands are required to retrieve data. the device is also ready to read array data after completing an embedded program or em- bedded erase algorithm. after the device accepts an erase suspend command, the device enters the erase suspend mode. the sys- tem can read array data using the standard read tim- ings, except that if it reads at an address within erase- suspended sectors, the device outputs status data. after completing a programming operation in the erase suspend mode, the system may once again read array data with the same exception. see ?erase sus- pend/erase resume commands? for more information on this mode. the system must issue the reset command to re-en- able the device for reading array data if dq5 goes high, or while in the autoselect mode. see the ?reset com- mand? section, next. see also ?requirements for reading array data? in the ?device bus operations? section for more information. the read operations table provides the read parame- ters, and figure 13 shows the timing diagram. reset command writing the reset command to the device resets the de- vice to reading array data. address bits are don?t care for this command. the reset command may be written between the se- quence cycles in an erase command sequence before erasing begins. this resets the device to reading array data. once erasure begins, however, the device ig- nores reset commands until the operation is complete. the reset command may be written between the se- quence cycles in a program command sequence be- fore programming begins. this resets the device to reading array data (also applies to programming in erase suspend mode). once programming begins, however, the device ignores reset commands until the operation is complete. the reset command may be written between the se- quence cycles in an autoselect command sequence. once in the autoselect mode, the reset command must be written to return to reading array data (also applies to autoselect during erase suspend). if dq5 goes high during a program or erase operation, writing the reset command returns the device to read- ing array data (also applies during erase suspend). autoselect command sequence the autoselect command sequence allows the host system to access the manufacturer and devices codes, and determine whether or not a sector is protected. table 8 shows the address and data requirements. this method is an alternative to that shown in table 3, which is intended for prom programmers and requires v id on address bit a9. the autoselect command sequenc e is initiated by writ- ing two unlock cycles, followed by the autoselect com- mand. the device then enters the autoselect mode, and the system may read at any address any number of times, without initiating another command sequence. a read cycle at address xx00h retrieves the manufac- turer code. a read cycle at address xx01h returns the device code. a read cycle containing a sector address (sa) and the address xx02h returns xx01h if that sec- tor is protected, or 00h if it is unprotected. refer to table 2 for valid sector addresses. the system must write the reset command to exit the autoselect mode and return to reading array data. byte program command sequence the device programs one byte of data for each pro- gram operation. the command sequence requires four bus cycles, and is initiated by writing two unlock write cycles, followed by the program set-up command. the program address and data are written next, which in turn initiate the embedded program algorithm. the system is not required to provide further controls or tim- ings. the device automatic ally generates the program pulses and verifies the programmed cell margin. table 8 shows the address and data requirements for the byte program command sequence. note that the au- toselect and cfi functions are unavailable when a pro- gram operation is in progress. when the embedded program algorithm is complete, the device then returns to reading array data and ad- dresses are no longer latched. the system can deter- mine the status of the program operation by using dq7, dq6, or ry/by#. see ?write operation status? for information on these status bits.
april 7, 2003 AM29LV017M 21 pending any commands written to the device during the em- bedded program algorithm are ignored. note that a hardware reset immediately terminates the program- ming operation. the byte program command se- quence should be reinitiated once the device has reset to reading array data, to ensure data integrity. programming is allowed in any sequence and across sector boundaries. a bit cannot be programmed from a ?0? back to a ?1?. attempting to do so may halt the operation and set dq5 to ?1,? or cause the data# polling algorithm to indicate the operation was suc- cessful. however, a succeeding read will show that the data is still ?0?. only erase operations can convert a ?0? to a ?1?. unlock bypass command sequence the unlock bypass feature allows the system to pro- gram bytes to the device faster than using the standard program command sequence. the unlock bypass com- mand sequence is initiated by first writing two unlock cycles. this is followed by a third write cycle containing the unlock bypass command, 20h. the device then en- ters the unlock bypass mode. a two-cycle unlock by- pass program command sequence is all that is required to program in this mode. the first cycle in this sequence contains the unlock bypass program com- mand, a0h; the second cycle contains the program ad- dress and data. additional data is programmed in the same manner. this mode dispenses with the initial two unlock cycles required in the standard program com- mand sequence, resulting in faster total programming time. table 8 shows the requirements for the command sequence. during the unlock bypass mode, only the unlock by- pass program and unlock bypass reset commands are valid. to exit the unlock bypass mode, the system must issue the two-cycle unlock bypass reset com- mand sequence. the first cycle must contain the data 90h; the second cycle the data 00h. addresses are don?t cares for both cycles. the device then returns to reading array data. figure 4 illustrates the algorithm for the program oper- ation. see the erase/program operations table in ?ac characteristics? for parameters, and to figure 15 for timing diagrams note: see table 8 for program command sequence. figure 4. program operation start write program command sequence data poll from system verify data? no yes last address? no yes programming completed increment address embedded program algorithm in progress
22 AM29LV017M april 7, 2003 pending program suspend/program resume command sequence the program suspend command allows the system to interrupt a programming operation or a write to buffer programming operation so that data can be read from any non-suspended sector. when the program sus- pend command is written during a programming pro- cess, the device halts the program operation within 15 s maximum (5 s typical) and updates the status bits. addresses are not required when writing the program suspend command. after the programming operation has been sus- pended, the system can read array data from any non- suspended sector. the program suspend command may also be issued during a programming operation while an erase is suspended. in this case, data may be read from any addresses not in erase suspend or program suspend. if a read is needed from the secsi sector area (one-time program area), then user must use the proper command sequences to enter and exit this region. the system may also write the autoselect command sequence when the device is in the program suspend mode. the system can read as many autoselect codes as required. when the device exits the autose- lect mode, the device reverts to the program suspend mode, and is ready for another valid operation. see autoselect command sequence for more information. after the program resume command is written, the device reverts to programming. the system can deter- mine the status of the program operation using the dq7 or dq6 status bits, just as in the standard pro- gram operation. see write operation status for more information. the system must write the program resume com- mand (address bits are don?t care) to exit the program suspend mode and continue the programming opera- tion. further writes of the resume command are ig- nored. another program suspend command can be written after the device has resume programming. figure 5. program suspend/program resume program operation or write-to-buffer sequence in progress write program suspend command sequence command is also valid for erase-suspended-program operations autoselect and secsi sector read operations are also allowed data cannot be read from erase- o r program-suspended sectors write program resume command sequence read data as required done reading? no yes write address/data xxxh/3030h device reverts to operation prior to program suspend write address/data xxxh/b0b0h wait 15 s
april 7, 2003 AM29LV017M 23 pending chip erase command sequence chip erase is a six bus cycle operation. the chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. two additional unlock write cycles are then followed by the chip erase command, which in turn invokes the embedded erase algorithm. the device does not require the system to preprogram prior to erase. the embedded erase algo- rithm automatically preprograms and verifies the entire memory for an all zero data pattern prior to electrical erase. the system is not re quired to provide any con- trols or timings during these operations. table 8 shows the address and data requirements for the chip erase command sequence. note that the autoselect, and cfi functions are unavailable w hen a erase operation is in progress. any commands written to the chip during the embed- ded erase algorithm are ignored. note that a hardware reset during the chip erase operation immediately ter- minates the operation. the chip erase command se- quence should be reinitiated once the device has returned to reading array data, to ensure data integrity. the system can determine the status of the erase op- eration by using dq7, dq6, dq2, or ry/by#. see ?write operation status? for information on these sta- tus bits. when the embedded erase algorithm is com- plete, the device returns to reading array data and addresses are no longer latched. figure 6 illustrates the algorithm for the erase opera- tion. see the erase/program operations tables in ?ac characteristics? for parameters, and to figure 16 for timing diagrams. sector erase command sequence sector erase is a six bus cycle operation. the sector erase command sequence is in itiated by writing two unlock cycles, followed by a set-up command. two ad- ditional unlock write cycles are then followed by the ad- dress of the sector to be erased, and the sector erase command. table 8 shows the address and data re- quirements for the sector erase command sequence. note that the autoselect and cfi functions are unavail- able when a erase operation is in progress. the device does not require the system to preprogram the memory prior to erase. the embedded erase algo- rithm automatically programs and verifies the sector for an all zero data pattern prior to electrical erase. the system is not required to provide any controls or tim- ings during these operations. after the command sequence is written, a sector erase time-out of 50 s begins. during the time-out period, additional sector addresses and sector erase com- mands may be written. loading the sector erase buffer may be done in any sequence, and the number of sec- tors may be from one sector to all sectors. the time be- tween these additional cycles must be less than 50 s, otherwise the last address and command might not be accepted, and erasure may begin. it is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. the interrupts can be re-enabled after the last sector erase command is written. if the time between additional sector erase commands can be assumed to be less than 50 s, the system need not monitor dq3. any command other than sector erase or erase suspend during the time-out period resets the device to reading array data. the system must rewrite the command sequence and any additional sector addresses and commands. the system can monitor dq3 to determine if the sector erase timer has timed out. (see the ?dq3: sector erase timer? section.) the time-out begins from the ris- ing edge of the final we# pulse in the command se- quence. once the sector erase operation has begun, only the erase suspend command is valid. all other commands are ignored. note that a hardware reset during the sector erase operation immediately terminates the op- eration. the sector erase command sequence should be reinitiated once the device has returned to reading array data, to ensure data integrity. when the embedded erase algorithm is complete, the device returns to reading array data and addresses are no longer latched. the system can determine the sta- tus of the erase operation by using dq7, dq6, dq2, or ry/by#. (refer to ?write operation status? for informa- tion on these status bits.) figure 6 illustrates the algorithm for the erase opera- tion. refer to the erase/program operations tables in the ?ac characteristics? se ction for parameters, and to figure 16 for timing diagrams. erase suspend/erase resume commands the erase suspend command allows the system to in- terrupt a sector erase operation and then read data from, or program data to, any sector not selected for erasure. this command is valid only during the sector erase operation, including the time-out period 50 s during the sector erase command sequence. the erase suspend command is ignored if written during the chip erase operation or embedded program algo- rithm. writing the erase suspend command during the sector erase time-out immediately terminates the time-out period and suspends the erase operation. ad- dresses are ?don?t-cares? when writing the erase sus- pend command. when the erase suspend command is written during a sector erase operation, the device requires a maximum of 20 s to suspend the erase operation. however, when the erase suspend command is written during the sector erase time-out, the device immediately ter-
24 AM29LV017M april 7, 2003 pending minates the time-out period and suspends the erase operation. after the erase operation has been suspended, the system can read array data from or program data to any sector not selected for erasure. (the device ?erase suspends? all sectors selected for erasure.) normal read and write timings and command definitions apply. reading at any address within erase-suspended sec- tors produces status data on dq7?dq0. the system can use dq7, or dq6 and dq2 together, to determine if a sector is actively erasing or is erase-suspended. see ?write operation status? for information on these status bits. after an erase-suspended program operation is com- plete, the system can once again read array data within non-suspended sectors. the system can determine the status of the program operation using the dq7 or dq6 status bits, just as in the standard program operation. see ?write operation status? for more information. the system may also write the autoselect command sequence when the device is in the erase suspend mode. the device allows reading autoselect codes even at addresses within erasing sectors, since the codes are not stored in the memory array. when the device exits the autoselect mode, the device reverts to the erase suspend mode, and is ready for another valid operation. see ?autoselect command sequence? for more information. the system must write the erase resume command (address bits are ?don?t care?) to exit the erase suspend mode and continue the sector erase operation. further writes of the resume command are ignored. another erase suspend command can be written after the de- vice has resumed erasing. notes: 1. see table 8 for erase command sequence. 2. see ?dq3: sector erase timer? for more information. figure 6. erase operation start write erase command sequence data poll from system data = ffh? no yes erasure completed embedded erase algorithm in progress
april 7, 2003 AM29LV017M 25 pending command definitions table 8. AM29LV017M command definitions legend: x = don?t care ra = address of the memory location to be read. rd = data read from location ra during read operation. pa = address of the memory location to be programmed. addresses are latched on the falling edge of the we# or ce# pulse. pd = data to be programmed at location pa. data is latched on the rising edge of we# or ce# pulse. sa = address of the sector to be erased or verified. address bits a20?a16 uniquely select any sector. notes: 1. see table 1 for descriptions of bus operations. 2. all values are in hexadecimal. 3. except when reading array or autoselect data, all bus cycles are write operations. 4. address bits are don?t care for unlock and command cycles, except when pa or sa is required. 5. no unlock or command cycles required when device is in read mode. 6. the reset command is required to return to the read mode when the device is in the autoselect mode or if dq5 goes high. 7. the fourth cycle of the autoselect command sequence is a read cycle. 8. the data is 00h for an unprotected sector and 01h for a protected sector. 9. command is valid when device is ready to read array data or when device is in autoselect mode. 10. the unlock bypass command is required prior to the unlock bypass program command. 11. the unlock bypass reset command is required to return to reading array data when the device is in the unlock bypass mode. 12. the system may read and program functions in non- erasing sectors, or enter the autoselect mode, when in the erase suspend mode. the erase suspend command is valid only during a sector erase operation. 13. the erase resume command is valid only during the erase suspend mode. command sequence 1) cycles bus cycles (notes 2?4) first second third fourth fifth sixth addr data addr data addr data addr data addr data addr data read 5) 1 ra rd reset 6) 1 xxx f0 auto- select 7) manufacturer id 4 xxx aa xxx 55 xxx 90 x00 01 device id 4 xxx aa xxx 55 xxx 90 x01 c8 sector protect verify 8) 4 xxx aa xxx 55 xxx 90 sa x02 00 xxx xxx xxx 01 cfi query 9) 1 55 98 byte program 4 xxx aa xxx 55 xxx a0 pa pd unlock bypass 3 xxx aa xxx 55 xxx 20 unlock bypass program 9) 2 xxx a0 pa pd unlock bypass reset 11) 2xxx 90 xxx 00 chip erase 6 xxx aa xxx 55 xxx 80 xxx aa xxx 55 xxx 10 sector erase 6 xxx aa xxx 55 xxx 80 xxx aa xxx 55 sa 30 program/erase suspend 12) 1 xxx b0 program/erase resume 13) 1xxx 30
26 AM29LV017M april 7, 2003 pending write operation status the device provides several bits to determine the sta- tus of a write operation: dq2, dq3, dq5, dq6, dq7, and ry/by#. table 9 and the following subsections de- scribe the functions of these bits. dq7, ry/by#, and dq6 each offer a method for determining whether a program or erase operation is complete or in progress. these three bits are discussed first. dq7: data# polling the data# polling bit, dq7, indicates to the host sys- tem whether an embedded algorithm is in progress or completed, or whether the device is in erase suspend. data# polling is valid after the rising edge of the final we# pulse in the program or erase command se- quence. during the embedded program algorithm, the device outputs on dq7 the complement of the datum pro- grammed to dq7. this dq7 status also applies to pro- gramming during erase suspend. when the embedded program algorithm is complete, the device outputs the datum programmed to dq7. the system must provide the program address to read valid status information on dq7. if a program address falls within a protected sector, data# polling on dq7 is active for ap- proximately 1 s, then the device returns to reading array data. during the embedded erase algorithm, data# polling produces a ?0? on dq7. when the embedded erase al- gorithm is complete, or if the device enters the erase suspend mode, data# polling produces a ?1? on dq7. this is analogous to the complement/true datum output described for the embedded program algorithm: the erase function changes all the bits in a sector to ?1?; prior to this, the device outputs the ?complement,? or ?0.? the system must provide an address within any of the sectors selected for erasure to read valid status in- formation on dq7. after an erase command sequence is written, if all sec- tors selected for erasing are protected, data# polling on dq7 is active for approximately 100 s, then the de- vice returns to reading array data. if not all selected sectors are protected, the embedded erase algorithm erases the unprotected sectors, and ignores the se- lected sectors that are protected. when the system detects dq7 has changed from the complement to true data, it can read valid data at dq7? dq0 on the following read cycles. this is because dq7 may change asynchronously with dq0?dq6 while output enable (oe#) is asserted low. figure 17, data# polling timings (during embedded algorithms), in the ?ac characteristics? section illustrates this. table 9 shows the outputs for data# polling on dq7. figure 7 shows the data# polling algorithm. dq7 = data? yes no no dq5 = 1? no yes yes fail pass read dq7?dq0 addr = va read dq7?dq0 addr = va dq7 = data? start notes: 1. va = valid address for programming. during a sector erase operation, a valid address is an address within any sector selected for erasure. during chip erase, a valid address is any non-protected sector address. 2. dq7 should be rechecked even if dq5 = ?1? because dq7 may change simultaneously with dq5. figure 7. data# polling algorithm
april 7, 2003 AM29LV017M 27 pending ry/by#: ready/busy# the ry/by# is a dedicated, open-drain output pin that indicates whether an embedded algorithm is in progress or complete. the ry/by# status is valid after the rising edge of the final we# pulse in the command sequence. since ry/by# is an open-drain output, sev- eral ry/by# pins can be tied together in parallel with a pull-up resistor to v cc . (the ry/by# pin is not avail- able on the 44-pin so package.) if the output is low (busy), the device is actively erasing or programming. (this includes programming in the erase suspend mode.) if the output is high (ready), the device is ready to read array data (including during the erase suspend mode), or is in the standby mode. table 9 shows the outputs for ry/by#. figures 14, 15 and 16 shows ry/by# for reset, program, and erase operations, respectively. dq6: toggle bit i toggle bit i on dq6 indicates whether an embedded program or erase algorithm is in progress or complete, or whether the device has entered the erase suspend mode. toggle bit i may be read at any address, and is valid after the rising edge of the final we# pulse in the command sequence (prior to the program or erase op- eration), and during the sector erase time-out. during an embedded program or erase algorithm op- eration, successive read cycles to any address cause dq6 to toggle (the system may use either oe# or ce# to control the read cycles). when the operation is com- plete, dq6 stops toggling. after an erase command sequence is written, if all sec- tors selected for erasing are protected, dq6 toggles for approximately 100 s, then returns to reading array data. if not all selected sectors are protected, the em- bedded erase algorithm erases the unprotected sec- tors, and ignores the selected sectors that are protected. the system can use dq6 and dq2 together to deter- mine whether a sector is actively erasing or is erase- suspended. when the device is actively erasing (that is, the embedded erase algorithm is in progress), dq6 toggles. when the device enters the erase suspend mode, dq6 stops toggling. however, the system must also use dq2 to determine which sectors are erasing or erase-suspended. alternatively, the system can use dq7 (see the subsection on dq7: data# polling). if a program address falls within a protected sector, dq6 toggles for approximately 1 s after the program command sequence is written, then returns to reading array data. dq6 also toggles during the erase-suspend-program mode, and stops toggling once the embedded pro- gram algorithm is complete. table 9 shows the outputs for toggle bit i on dq6. fig- ure 8 shows the toggle bit algorithm in flowchart form, and the section ?reading toggle bits dq6/dq2? ex- plains the algorithm. figure 18 in the ?ac characteris- tics? section shows the toggle bit timing diagrams. figure 19 shows the differences between dq2 and dq6 in graphical form. see also the subsection on dq2: toggle bit ii. dq2: toggle bit ii the ?toggle bit ii? on dq2, when used with dq6, indi- cates whether a particular sector is actively erasing (that is, the embedded erase algorithm is in progress), or whether that sector is erase-suspended. toggle bit ii is valid after the rising edge of the final we# pulse in the command sequence. dq2 toggles when the system reads at addresses within those sectors that have been selected for era- sure. (the system may use either oe# or ce# to con- trol the read cycles.) but dq2 cannot distinguish whether the sector is actively erasing or is erase-sus- pended. dq6, by comparison, indicates whether the device is actively erasing, or is in erase suspend, but cannot distinguish which sectors are selected for era- sure. thus, both status bits are required for sector and mode information. refer to table 9 to compare outputs for dq2 and dq6. figure 8 shows the toggle bit algorithm in flowchart form, and the section ?reading toggle bits dq6/dq2? explains the algorithm. see also the dq6: toggle bit i subsection. figure 18 shows the toggle bit timing dia- gram. figure 19 shows the differences between dq2 and dq6 in graphical form. reading toggle bits dq6/dq2 refer to figure 8 for the following discussion. when- ever the system initially begins reading toggle bit sta- tus, it must read dq7?dq0 at least twice in a row to determine whether a toggle bit is toggling. typically, the system would note and store the value of the toggle bit after the first read. after the second read, the system would compare the new value of the toggle bit with the first. if the toggle bit is not toggling, the device has com- pleted the program or erase operation. the system can read array data on dq7?dq0 on the following read cy- cle. however, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the sys- tem also should note whether the value of dq5 is high (see the section on dq5). if it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as dq5 went high. if the toggle bit is no longer toggling, the device has successfully completed the program or erase operation. if it is still toggling, the device did not completed the operation successfully, and the system
28 AM29LV017M april 7, 2003 pending must write the reset command to return to reading array data. the remaining scenario is that the system initially de- termines that the toggle bit is toggling and dq5 has not gone high. the system may continue to monitor the toggle bit and dq5 through successive read cycles, de- termining the status as described in the previous para- graph. alternatively, it may choose to perform other system tasks. in this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of figure 8). table 9 shows the outputs for toggle bit i on dq6. fig- ure 8 shows the toggle bit algorithm. figure 18 in the ?ac characteristics? section shows the toggle bit timing diagrams. figure 19 shows the differences between dq2 and dq6 in graphical form. see also the subsec- tion on dq2: toggle bit ii. start no yes yes dq5 = 1? no yes toggle bit = toggle? no program/erase operation not complete, write reset command program/erase operation complete read dq7?dq0 toggle bit = toggle? read dq7?dq0 twice read dq7?dq0 notes: 1. read toggle bit twice to determine whether or not it is toggling. see text. 2. recheck toggle bit because it may stop toggling as dq5 changes to ?1?. see text. figure 8. toggle bit algorithm 1) (notes 1, 2)
april 7, 2003 AM29LV017M 29 pending dq5: exceeded timing limits dq5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. under these conditions dq5 produces a ?1.? this is a failure condition that indicates the program or erase cycle was not successfully completed. the dq5 failure condition may appear if the system tries to program a ?1? to a location that is previously programmed to ?0.? only an erase operation can change a ?0? back to a ?1.? under this condition, the device halts the operation, and when the operation has exceeded the timing limits, dq5 produces a ?1.? under both these conditions, the system must issue the reset command to return the device to reading array data. dq3: sector erase timer after writing a sector erase command sequence, the system may read dq3 to determine whether or not an erase operation has begun. (the sector erase timer does not apply to the chip erase command.) if addi- tional sectors are selected for erasure, the entire time- out also applies after each additional sector erase com- mand. when the time-out is complete, dq3 switches from ?0? to ?1.? if the time between additional sector erase commands from the system can be assumed to be less than 50 s, the system need not monitor dq3. see also the ?sector erase command sequence? sec- tion. after the sector erase command sequence is written, the system should read the status on dq7 (data# poll- ing) or dq6 (toggle bit i) to ensure the device has ac- cepted the command sequence, and then read dq3. if dq3 is ?1?, the internally controlled erase cycle has be- gun; all further commands (other than erase suspend) are ignored until the erase operation is complete. if dq3 is ?0?, the device will accept additional sector erase commands. to ensure the command has been accepted, the system software should check the status of dq3 prior to and following each subsequent sector erase command. if dq3 is high on the second status check, the last command might not have been ac- cepted. table 9 shows the outputs for dq3. table 9. write operation status notes: 1. dq5 switches to ?1? when an embedded program or embedded erase operation has exceeded the maximum timing limits. see ?dq5: exceeded timing limits? for more information. 2. dq7 and dq2 require a valid address when reading status information. refer to the appropriate subsection for further details. operation dq7 2) dq6 dq5 1) dq3 dq2 2) ry/by# standard mode embedded program algorithm dq7# toggle 0 n/a no toggle 0 embedded erase algorithm 0 toggle 0 1 toggle 0 program suspend mode program- suspend read program-suspended sector invalid (not allowed) non-program suspended sector data erase suspend mode reading within erase suspended sector 1 no toggle 0 n/a toggle 1 reading within non-erase suspended sector data data data data data 1 erase-suspend-program dq7# toggle 0 n/a n/a 0
30 AM29LV017M april 7, 2003 pending absolute maximum ratings storage temperature plastic packages . . . . . . . . . . . . . . . ?55 c to +150 c ambient temperature with power applied . . . . . . . . . . . . . ?65 c to +125 c voltage with respect to ground v cc (note 1) . . . . . . . . . . . . . . . . .?0.5 v to +4.0 v a9 , oe# , and reset# (note 2) . . . . . . . . . . . .?0.5 v to +12.5 v all other pins (note 1) . . . . . . ?0.5 v to v cc +0.5 v output short circuit current (note 3) . . . . . . 200 ma notes: 1. minimum dc voltage on input or i/o pins is ?0.5 v. during voltage transitions, input or i/o pins may overshoot v ss to ?2.0 v for periods of up to 20 ns. see figure 9. maximum dc voltage on input or i/o pins is v cc +0.5 v. during voltage transitions, input or i/o pins may overshoot to v cc +2.0 v for periods up to 20 ns. see figure 10. 2. minimum dc input voltage on pins a9, oe#, and reset# is ?0.5 v. during voltage transitions, a9, oe#, and reset# may overshoot v ss to ?2.0 v for periods of up to 20 ns. see figure 9. maximum dc input voltage on pin a9 is +12.5 v which may overshoot to 14.0 v for periods up to 20 ns. 3. no more than one output may be shorted to ground at a time. duration of the short circuit should not be greater than one second. stresses above those listed under ?absolute maximum ratings? may cause permanent damage to the device. this is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this data sheet is not implied. exposure of the device to absolute maximum rating conditions for extended periods may affect device reliability. operating ranges commercial (c) devices ambient temperature (t a ) . . . . . . . . . . . 0c to +70c industrial (i) devices ambient temperature (t a ) . . . . . . . . . ?40c to +85c v cc supply voltages v cc (full voltage range) . . . . . . . . . . . .+2.7 v to 3.6 v v cc (regulated voltage range) . . . . . . .+3.0 v to 3.6 v operating ranges define those limits between which the func- tionality of the device is guaranteed. 20 ns 20 ns +0.8 v ?0.5 v 20 ns ?2.0 v figure 9. maximum negative overshoot waveform 20 ns 20 ns v cc +2.0 v v cc +0.5 v 20 ns 2.0 v figure 10. maximum positive overshoot waveform
april 7, 2003 AM29LV017M 31 pending dc characteristics cmos compatible notes: 1. on the wp#/acc pin only, the maximum input load current when wp# = v il is 5.0 a. 2. the i cc current listed is typically less than 2 ma/mhz, with oe# at v ih . 3. maximum i cc specifications are tested with v cc = v cc max. 4. i cc active while embedded erase or embedded program is in progress. 5. automatic sleep mode enables the low power mode when addresses remain stable for t acc + 30 ns. 6. if v io < v cc , maximum v il for ce# and dq i/os is 0.3 v io . maximum v ih for these connections is v io + 0.3 v 7. v cc voltage requirements. 8. v io voltage requirements. 9. not 100% tested. parameter description test conditions min typ max unit i li input load current v in = v ss to v cc , v cc = v cc max 1.0 a i lit a9 input load current v cc = v cc max ; a9 = 12.5 v 35 a i lr reset leakage current v cc = v cc max ; reset# = 12.5 v 35 a i lo output leakage current v out = v ss to v cc , v cc = v cc max 1.0 a i cc1 v cc active read current (notes 1, 2) ce# = v il, oe# = v ih 5 mhz 15 30 ma 1 mhz 2 10 i cc2 v cc active write current (notes 2, 3, 5) ce# = v il, oe# = v ih 40 60 ma i cc3 v cc standby current (note 2) ce#, reset# = v cc 0.3 v 0.4 5 a i cc4 v cc reset current (note 2) reset# = v ss 0.3 v 0.8 5 a i cc5 automatic sleep mode (notes 2, 4) v ih = v cc 0.3 v; v il = v ss 0.3 v 0.4 5 a v il1 input low voltage 1(6, 7) ?0.5 0.8 v v ih1 input high voltage 1 (6, 7) 1.9 v cc + 0.5 v v il2 input low voltage 2 (6, 8) ?0.5 0.3 x v io v v ih2 input high voltage 2 (6, 8) 1.9 v io + 0.5 v v id voltage for autoselect and temporary sector unprotect v cc = 3.3 v 11.5 12.5 v v ol output low voltage i ol = 4.0 ma, v cc = v cc min 0.45 v v oh1 output high voltage i oh = ?2.0 ma, v cc = v cc min = v io 0.85 v io v v oh2 i oh = ?100 a, v cc = v cc min = v io v io ?0.4 v v lko low v cc lock-out voltage (5) 2.3 2.5 v
32 AM29LV017M april 7, 2003 pending test conditions table 10. test specifications key to switching waveforms 2.7 k ? c l 6.2 k ? 3.3 v device under te s t figure 11. test setup note: diodes are in3064 or equivalent test condition 70, 70r 90, 90r 120, 120r unit output load 1 ttl gate output load capacitance, c l (including jig capacitance) 30 100 pf input rise and fall times 5ns input pulse levels 0.0?3.0 v input timing measurement reference levels 1.5 v output timing measurement reference levels 1.5 v waveform inputs outputs steady changing from h to l changing from l to h don?t care, any change permitted changing, state unknown does not apply center line is high impedance state (high z) 3.0 v 0.0 v 1.5 v 1.5 v output measurement level input figure 12. input waveforms and measurement levels
april 7, 2003 AM29LV017M 33 pending ac characteristics read operations notes: 1. not 100% tested. 2. see figure 11 and table 10 for test specifications. parameter description speed options jedec std test setup 70, 70r 90, 90r 120, 120r unit t avav t rc read cycle time 1) min 70 90 120 ns t avqv t acc address to output delay ce# = v il oe# = v il max 70 90 120 ns t elqv t ce chip enable to output delay oe# = v il max 70 90 120 ns t glqv t oe output enable to output delay max 30 35 50 ns t ehqz t df chip enable to output high z 1) max 16 ns t ghqz t df output enable to output high z 1) max 16 ns t oeh output enable hold time 1) read min 0 ns toggle and data# polling min 10 ns t axqx t oh output hold time from addresses, ce# or oe#, whichever occurs first 1) min 0 ns t ce outputs we# addresses ce# oe# high z output valid high z addresses stable t rc t acc t oeh t oe 0 v ry/by# reset# t df t oh figure 13. read operations timings
34 AM29LV017M april 7, 2003 pending ac characteristics hardware reset (reset#) note: not 100% tested. parameter description all speed options jedec std test setup unit t ready reset# pin low (during embedded algorithms) to read or write (see note) max 20 s t ready reset# pin low (not during embedded algorithms) to read or write (see note) max 500 ns t rp reset# pulse width min 500 ns t rh reset# high time before read (see note) min 50 ns t rpd reset# low to standby mode min 20 s t rb ry/by# recovery time min 0 ns reset# ry/by# ry/by# t rp t ready reset timings not during embedded algorithms t ready ce#, oe# t rh ce#, oe# reset timings during embedded algorithms reset# t rp t rb figure 14. reset# timings
april 7, 2003 AM29LV017M 35 pending ac characteristics erase/program operations notes: 1. not 100% tested. 2. see the ?erase and programming performance? section for more information. parameter speed options jedec std description 70, 70r 90, 90r 120, 120r unit t avav t wc write cycle time 1) min 70 90 120 ns t avwl t as address setup time min 0 ns t wlax t ah address hold time min 45 45 50 ns t dvwh t ds data setup time min 35 45 50 ns t whdx t dh data hold time min 0 ns t oes output enable setup time 1) min 0 ns t ghwl t ghwl read recovery time before write (oe# high to we# low) min 0 ns t elwl t cs ce# setup time min 0 ns t wheh t ch ce# hold time min 0 ns t wlwh t wp write pulse width min 35 35 50 ns t whwl t wph write pulse width high min 30 ns t whwh1 t whwh1 programming operation 2) typ tbd s t whwh2 t whwh2 sector erase operation 2) typ 0.4 sec t vcs v cc setup time 1) min 50 s t rb recovery time from ry/by# min 0 ns t busy program/erase valid to ry/by# delay min 90 ns
36 AM29LV017M april 7, 2003 pending ac characteristics oe# we# ce# v cc data addresses t ds t ah t dh t wp pd t whwh1 t wc t as t wph t vcs xxxh pa pa read status data (last two cycles) a0h t cs status d out program command sequence (last two cycles) ry/by# t rb t busy t ch pa note: pa = program address, pd = program data, d out is the true data at the program address. figure 15. program operation timings oe# ce# addresses v cc we# data xxxh sa t ah t wp t wc t as t wph xxxh for chip erase 10 for chip erase 30h t ds t vcs t cs t dh 55h t ch in progress complete t whwh2 va va erase command sequence (last two cycles) read status data ry/by# t rb t busy note: sa = sector address (for sector erase), va = valid address for reading status data (see ?write operation status?). figure 16. chip/sector erase operation timings
april 7, 2003 AM29LV017M 37 pending ac characteristics we# ce# oe# high z t oe high z dq7 dq0?dq6 ry/by# t busy complement tr u e addresses va t oeh t ce t ch t oh t df va va status data complement status data tr u e valid data valid data t acc t rc note: va = valid address. figure shows are first status cycle after command sequence, last status read cycle, and array data read cyc le. figure 17. data# polling timings (during embedded algorithms)
38 AM29LV017M april 7, 2003 pending ac characteristics we# ce# oe# high z t oe dq6/dq2 ry/by# t busy addresses va t oeh t ce t ch t oh t df va va t acc t rc valid data valid status valid status (first read) (second read) (stops toggling) valid status va note: va = valid address; not required for dq6. figure shows first two status cycle after command sequence, last status read cycle, and array data read cycle. figure 18. toggle bit timings (during embedded algorithms) note: the system can use oe# or ce# to toggle dq2/dq6. dq2 toggles only when read at an address within an erase-suspended sector. figure 19. dq2 vs. dq6 enter erase erase erase enter erase suspend program erase suspend read erase suspend read erase we# dq6 dq2 erase complete erase suspend suspend program resume embedded erasing
april 7, 2003 AM29LV017M 39 pending ac characteristics temporary sector unprotect note: not 100% tested. parameter all speed options jedec std description unit t vidr v id rise and fall time (see note) min 500 ns t rsp reset# setup time for temporary sector unprotect min 4 s reset# t vidr 12 v 0 or 3 v ce# we# ry/by# t vidr t rsp program or erase command sequence figure 20. temporary sector unprotect timing diagram
40 AM29LV017M april 7, 2003 pending ac characteristics sector prote ct: 150 s sector unprot ect: 15 ms 1 s reset# sa, a6, a1, a0 data ce# we# oe# 60h 60h 40h valid* valid* valid* status sector protect/unprotect verify v id v ih note: for sector protect, a6 = 0, a1 = 1, a0 = 0. for sector unprotect, a6 = 1, a1 = 1, a0 = 0. figure 21. sector protect/unprotect timing diagram
april 7, 2003 AM29LV017M 41 pending ac characteristics alternate ce# controlled erase/program operations notes: 1. not 100% tested. 2. see the ?erase and programming performance? section for more information. parameter speed options jedec std description 70, 70r 90, 90r 120, 120r unit t avav t wc write cycle time 1) min 70 90 120 ns t avel t as address setup time min 0 ns t elax t ah address hold time min 45 45 50 ns t dveh t ds data setup time min 35 45 50 ns t ehdx t dh data hold time min 0 ns t oes output enable setup time min 0 ns t ghel t ghel read recovery time before write (oe# high to we# low) min 0 ns t wlel t ws we# setup time min 0 ns t ehwh t wh we# hold time min 0 ns t eleh t cp ce# pulse width min 35 35 50 ns t ehel t cph ce# pulse width high min 30 ns t whwh1 t whwh1 programming operation 2) typ tbd s t whwh2 t whwh2 sector erase operation 2) typ 0.4 sec
42 AM29LV017M april 7, 2003 pending ac characteristics t ghel t ws oe# ce# we# reset# t ds data t ah addresses t dh t cp dq7# d out t wc t as t cph pa data# polling a0 for program 55 for erase t rh t whwh1 or 2 ry/by# t wh pd for program 30 for sector erase 10 for chip erase xxx for program xxx for erase pa for program sa for sector erase xxx for chip erase t busy notes: 1. pa = program address, pd = program data, d out = data out, dq7# = complement of data written to device. 2. figure indicates the last two bus cycles of the command sequence. figure 22. alternate ce# controlled write operation timings
april 7, 2003 AM29LV017M 43 pending erase and programming performance notes: 1. typical program and erase times assume the following conditions: 25 c, 3.0 v v cc , 100,000 cycles. additionally, programming typicals assume checkerboard pattern. 2. under worst case conditions of 90c, v cc = 2.7 v, 100,000 cycles. 3. the typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than the maximum program times listed. 4. in the pre-programming step of the embedded erase algorithm, all bytes are programmed to 00h before erasure. 5. system-level overhead is the time required to execute the four- or two-bus-cycle sequence for the program command. see table 8 for further information on command definitions. 6. the device has a guaranteed minimum erase and program cycle endurance of 100,000 cycles. latchup characteristics includes all pins except v cc . test conditions: v cc = 3.0 v, one pin at a time. tsop pin capacitance notes: 1. sampled, not 100% tested. 2. test conditions t a = 25c, f = 1.0 mhz. data retention parameter typ 1) max 2) unit comments sector erase time 0.4 15 s excludes 00h programming prior to erasure 4) chip erase time 22.5 s byte programming time tbd tbd s excludes system level overhead 5) chip programming time 4) tbd tbd s description min max input voltage with respect to v ss on all pins except i/o pins (including a9, oe#, and reset#) ?1.0 v 12.5 v input voltage with respect to v ss on all i/o pins ?1.0 v v cc + 1.0 v v cc current ?100 ma +100 ma parameter symbol parameter description test setup typ max unit c in input capacitance v in = 0 6 7.5 pf c out output capacitance v out = 0 8.5 12 pf c in2 control pin capacitance v in = 0 7.5 9 pf parameter test conditions min unit minimum pattern data retention time 150 c10 years 125 c20 years
44 AM29LV017M april 7, 2003 pending physical dimensions* ts 040?40-pin standard tsop * for reference only. bsc is an ansi standard for basic space centering. dwg rev aa; 10/99
april 7, 2003 AM29LV017M 45 pending physical dimensions tsr040?40-pin reverse tsop * for reference only. bsc is an ansi standard for basic space centering. dwg rev aa; 10/99
46 AM29LV017M april 7, 2003 pending physical dimensions fba048?48-ball fine-pitch ball grid array (fbga) 8x6mm package dwg rev af; 10/99
april 7, 2003 AM29LV017M 47 pending revision summary revision a (june 24, 2002) initial release. revision a + 1 (july 3, 2002) corrected fbga package markings in ordering infor- mation. corrected numbers in dc characteristics table. removed zero power flash figures for dc character- istics, replaced with tbd. corrected erase and programming performance times. corrected minimum erase and program cycle endur- ance specification. revision b (february 6, 2003) global added regulated speed options and updated effected tables in datasheet. destinctive characteristics added secsi text. general description added page suspend text. product selector guide added another vcc range and regulated speed options. ordering information added regulated speed options. removed commercial temperature range. changed wc package type to wa package type. byte/word program command sequence, sector erase command sequence, and chip erase com- mand sequence noted that the secsi sector, autoselect, and cfi functions are unavailable when a program or erase operation is in progress. common flash memory interface (cfi) changed cfi website address. absolute maximum rating changed the ambient temperature with power applied from ?55 c to +125 c to ?65 c to +125 c. figure 6. program suspend/program resume added text and flowchart. table 8. primary vendor-specific extend query added proccess technology reference to the 45h ad- dress and corrected data variable. table 10. write operation status added program suspend mode. operating ranges corrected typos in v io ranges. dc characteristics table changed v ih1 and v ih2 minimum to 1.9. removed typos in notes. hardware reset, erase and program operations, temporary sector unprotect, and alternate ce# controlled erase and program operations added note. changed t whwh1 to tbd. cmos compatible removed v il , v ih , v ol , and v oh from table and added v il1 , v ih1 , v il2 , v ih2 , v ol , v oh1 , and v oh2 from the cmos table in the am29lv640mh/l datasheet. customer lockable: secsi sector not programmed or protected at the factory. added second bullet, secsi sector-protect verify text and figure 3. physical dimensions changed the fbc048 package to the fba048 package. revision c (april 7, 2003) global coverted to ?production pending? status. trademarks copyright ? 2003 advanced micro devices, inc. all rights reserved. amd, the amd logo, mirrorbit tm , and combinations thereof are registered trademarks of advanced micro devices, inc. expressflash is a trademark of advanced micro devices, inc. product names used in this publication are for identification purposes only and may be trademarks of their respective companies .
?2003 advanced micro devices, inc . 01/03 printed in usa one amd place, p.o. box 3453, sunnyvale, ca 94088-3453 408-732-2400 twx 910-339-9280 telex 34-6306 800-538-8450 http://www.amd.com advanced micro devices reserves the right to make changes in its product without notice in order to impr ove design or performance characteristics.the performance characteristics listed in this document are guaranteed by specific tests, guard banding, design and other practices common to the industry. for specific testing details, contact your local amd sales representativ e.the company assumes no responsibility for the use of any circuits described herein. ? advanced micro devices, inc. all rights reser ved. amd, the amd arrow logo and combination thereof, are trademarks of advanced micro devices, inc. other product names are for informational purposes only and may be trademarks of their respective companies. north america alabama . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(256)830-9192 arizona . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (602)242-4400 california, irvine . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 49)450-7500 sunnyvale . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (408)732-2400 colorado . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (303)741-2900 connecticut . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (203)264-7800 florida, clearwater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 7 2 7)793-0055 miami (lakes) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (305)820-1113 georgia . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (770)814-0224 illinois, chicago . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (630)773-4422 massachusetts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(781)213-6400 michigan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(248)471-6294 minnesota . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(612)745-0005 new jersey, chatham . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 73)701-1777 new york . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(716)425-8050 north carolina . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(919)840-8080 oregon . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(503)245-0080 pennsylvania . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(215)340-1187 south dakota . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (605)692-5777 texas, austin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (512)346-7830 dallas . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 7 2)985-1344 houston . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (281)376-8084 virginia . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(703)736-9568 international australia,north ryde . . . . . . . . . . . . . . . . . . . . . . .tel(61)2-88-777-222 belgium, antwerpen . . . . . . . . . . . . . . . . . . . . . . . . t el(32)3-248-43-00 brazil, san paulo . . . . . . . . . . . . . . . . . . . . . . . . . . t el(55)11-5501-2105 china, beijing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(86)10-6510-2188 shanghai . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(86)21-635-00838 shenzhen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(86)755-246-1550 finland, helsinki . . . . . . . . . . . . . . . . . . . . . . t el(358)881-3117 france, paris . . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(33)-1-49751010 germany, bad homburg . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(49)-6172- 92670 munich . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tel(49)-89-450530 hong kong, causeway bay . . . . . . . . . . . . . . . . . . . t el(85)2-2956-0388 italy, milan . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(39)-02-381961 india, new delhi . . . . . . . . . . . . . . . . . . . . . . . . . . t el(91)11-623-8620 japan, osaka . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(81)6-6243-3250 tokyo . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .tel(81)3-3346-7600 korea, seoul . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(82)2-3468-2600 russia, moscow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .t el(7)-095-795-06-22 sweden, stockholm . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(46)8-562-540-00 taiwan,taipei . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(886)2-8773-1555 united kingdom, frimley . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(44)1276-803100 haydcock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . t el(44)1942-272888 representatives in u.s. and canada arizona, tempe - centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (480)839-2320 california, calabasas - centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (818)878-5800 irvine - centaur . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 9 49)261-2123 san diego - centaur. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 8 58)278-4950 santa clara - fourfront. . . . . . . . . . . . . . . . . . . . . . . . . . . . ( 4 0 8)350-4800 canada, burnaby, b.c. - davetek marketing. . . . . . . . . . . . . . . . . . . . (604)430-3680 calgary, alberta - davetek marketing. . . . . . . . . . . . . . . . . ( 4 0 3)283-3577 kanata, ontario - j-squared tech. . . . . . . . . . . . . . . . . . . . (613)592-9540 mississauga, ontario - j-squared tech. . . . . . . . . . . . . . . . . . (905)672-2030 st laurent, quebec - j-squared tech. . . . . . . . . . . . . . . . (514)747-1211 colorado, golden - compass marketing . . . . . . . . . . . . . . . . . . . . . . (303)277-0456 florida, melbourne - marathon technical sales . . . . . . . . . . . . . . . . (321)728-7706 ft. lauderdale - marathon technical sales . . . . . . . . . . . . . . (954)527-4949 orlando - marathon technical sales . . . . . . . . . . . . . . . . . . ( 4 0 7)872-5775 st. petersburg - marathon technical sales . . . . . . . . . . . . . . ( 7 2 7)894-3603 georgia, duluth - quantum marketing . . . . . . . . . . . . . . . . . . . . . ( 6 78)584-1128 illinois, skokie - industrial reps, inc. . . . . . . . . . . . . . . . . . . . . . . . . ( 8 4 7)967-8430 indiana, kokomo - sai . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(765)457-7241 iowa, cedar rapids - lorenz sales . . . . . . . . . . . . . . . . . . . . . . (319)294-1000 kansas, lenexa - lorenz sales . . . . . . . . . . . . . . . . . . . . . . . . . (913)469-1312 massachusetts, burlington - synergy associates . . . . . . . . . . . . . . . . . . . . . (781)238-0870 michigan, brighton - sai . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . (810)227-0007 minnesota, st. paul - cahill, schmitz & cahill, inc. . . . . . . . . . . . . . . . . . (651)699-0200 missouri, st. louis - lorenz sales . . . . . . . . . . . . . . . . . . . . . . . . . . (314)997-4558 new jersey, mt. laurel - sj associates . . . . . . . . . . . . . . . . . . . . . . . . . (856)866-1234 new york, buffalo - nycom, inc. . . . . . . . . . . . . . . . . . . . . . . . . .(716)741-7116 east syracuse - nycom, inc. . . . . . . . . . . . . . . . . . . . . . . (315)437-8343 pittsford - nycom, inc. . . . . . . . . . . . . . . . . . . . . . . . . . . (716)586-3660 rockville centre - sj associates . . . . . . . . . . . . . . . . . . . . (516)536-4242 north carolina, raleigh - quantum marketing . . . . . . . . . . . . . . . . . . . . . . (919)846-5728 ohio, middleburg hts - dolfuss root & co. . . . . . . . . . . . . . . . . (440)816-1660 powell - dolfuss root & co. . . . . . . . . . . . . . . . . . . . . . . (614)781-0725 vandalia - dolfuss root & co. . . . . . . . . . . . . . . . . . . . . .(937)898-9610 westerville - dolfuss root & co. . . . . . . . . . . . . . . . . . . (614)523-1990 oregon, lake oswego - i squared, inc. . . . . . . . . . . . . . . . . . . . . . . (503)670-0557 utah, murray - front range marketing . . . . . . . . . . . . . . . . . . . . ( 8 0 1)288-2500 virginia, glen burnie - coherent solution, inc. . . . . . . . . . . . . . . . . (410)761-2255 washington, kirkland - i squar ed,inc. . . . . . . . . . . . . . . . . . . . . . . . . . .(425)822-9220 wisconsin, pewaukee - industrial representatives . . . . . . . . . . . . . . . . ( 2 6 2)574-9393 representatives in latin america argentina, capital f ederal argentina/ww rep. . . . . . . . . . . . . . . . . . . . 54-11)4373-0655 chile, santiago - latinrep/wwrep. . . . . . . . . . . . . . . . . . . . . . . . . .(+562)264-0993 columbia, bogota - dimser. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .(571)410-4182 mexico, guadalajara - latinrep/ww rep. . . . . . . . . . . . . . . . . . . . ( 5 23)817-3900 mexico city - latinrep/ww rep. . . . . . . . . . . . . . . . . . . . ( 5 25)752-2727 monterrey - latinrep/ww rep. . . . . . . . . . . . . . . . . . . . .(528)369-6828 puert o rico, boqueron - infitronics. . . . . . . . . . . . . . . . . . . . . . . . . . . . (787)851-6000 sales offices and representatives es


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